Senior Semiconductor Packaging Engineer - Flip-Chip & SI
Link-Worldwide
Link-Worldwide is hiring a Semiconductor Packaging Engineer in Guadalajara. The ideal candidate will have over 8 years of experience in flip-chip BGA package design and expertise in Cadence APD or similar tools.
The role involves ensuring package-level signal integrity and power integrity, alongside excellent self-management. This is an exciting opportunity to work in a dynamic environment focused on innovation.
#J-18808-LjbffrVacante publicada el 19 horas atrás
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