Physical Design Engineer Tlaquepaque, Jalisco, Mexico Posted 19 hours ago

## Physical Design EngineerTlaquepaque, Jalisco, MexicoApply NowFind out how well you match with this jobJob ID: JR112514**Our vision is to transform how the world uses information to enrich life for *all*.**Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.We are building innovative physical design capabilities that help bring advanced semiconductor products from concept to silicon. Our team collaborates across design, verification, and manufacturing disciplines to deliver high-quality solutions using leading-edge technologies. We value technical excellence, continuous learning, and a culture of teamwork and innovation.As a Physical Design Engineer, you will play a key role in driving semicustom physical implementation from netlist handoff through tapeout. You will work closely with cross-functional engineering teams to optimize design quality, achieve physical signoff, and support successful product delivery in advanced technology nodes.**Responsibilities:*** Execute the semi-custom physical design flow from netlist handoff through physical verification and tapeout* Develop and maintain floorplans, placement, routing, power distribution networks (PDN), and physical design constraints* Perform DRC, LVS, parasitic extraction, and physical signoff activities* Analyze and resolve timing, signal integrity, electromigration, IR drop, reliability, and manufacturability issues* Partner with cross-functional teams to drive design closure, debug issues, and support tapeout readiness**Minimum Qualifications:*** Bachelor's or Master's degree in Electrical Engineering or a related field* Experience in VLSI physical design, semiconductor layout, or physical implementation* Knowledge of semicustom physical design flows, physical verification tools, and advanced technology node methodologies* Understanding of timing closure, PDN build, signal integrity, durability, and production feasibility concepts* Strong analytical, problem-solving, communication, and collaboration skills**Preferred Qualifications:*** Experience supporting physical design closure and tapeout activities for complex semiconductor products* Knowledge of physical design automation methodologies and process improvement practices* Experience documenting technical decisions and participating in design reviews* Familiarity with AI-assisted engineering tools to improve design productivity and problem-solving efficiency* Experience working with Agentic AI tools to assist with design and verification #J-18808-Ljbffr