Integrated Circuit Package Design Engineer

Job Title: Integrated Circuit Package Design Engineer

Job Description

We are seeking an experienced package design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 224G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5, and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new designs and contribute to efficiency improvements for our design team.

Responsibilities

Design complex flip-chip-BGA packages for high-speed SerDes and high-power delivery needs.

Collaborate with the worldwide R&D team to develop high-performance package designs for ASICs used in AI, networking, HPC, and 5G base stations.

Determine the necessary package type by analyzing the chip.

Assign pins and layout critical structures for SerDes, ADC/DAC, DDR, etc.

Apply knowledge of package-level signal integrity and power integrity to package designs.

Work closely with signal integrity and power integrity partners to gather requirements and de-risk engineering issues.

Route and develop structures, manage critical signal and power integrity tasks.

Cooperate with internal team members and external designers across multiple time zones.

Manage the project end-to-end, from gathering requirements to release to manufacture.

Solve problems related to warpage, power integrity, and run SI Wave to extract power integrity models.

Essential Skills

8+ years of experience in flip-chip-BGA package design with high-speed SerDes (BSEE or similar field) or 6+ years of experience with MSEE or similar field.

Experience with Cadence APD (Allegro Package Designer) or equivalent tools.

Knowledge of package-level signal integrity and power integrity.

Self-management and organizational skills.

Additional Skills & Qualifications

Project management experience is highly desirable.

Experience in selecting package layers and managing pin assignments.

Ability to work collaboratively with a global team across different time zones.